Damage evaluation in graphene underlying atomic layer deposition dielectrics

Xiaohui Tang, Nicolas Reckinger, Olivier Poncelet, Pierre Louette, Ferran Ureña, Hosni Idrissi, Stuart Turner, Damien Cabosart, Jean François Colomer, Jean Pierre Raskin, Benoit Hackens, Laurent A. Francis

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Abstract

Based on micro-Raman spectroscopy (μRS) and X-ray photoelectron spectroscopy (XPS), we study the structural damage incurred in monolayer (1L) and few-layer (FL) graphene subjected to atomic-layer deposition of HfO<inf>2</inf> and Al<inf>2</inf> O<inf>3</inf> upon different oxygen plasma power levels. We evaluate the damage level and the influence of the HfO<inf>2</inf> thickness on graphene. The results indicate that in the case of Al<inf>2</inf> O<inf>3</inf>/graphene, whether 1L or FL graphene is strongly damaged under our process conditions. For the case of HfO 2 /graphene, μRS analysis clearly shows that FL graphene is less disordered than 1L graphene. In addition, the damage levels in FL graphene decrease with the number of layers. Moreover, the FL graphene damage is inversely proportional to the thickness of HfO<inf>2</inf> film. Particularly, the bottom layer of twisted bilayer (t-2L) has the salient features of 1L graphene. Therefore, FL graphene allows for controlling/limiting the degree of defect during the PE-ALD HfO<inf>2</inf> of dielectrics and could be a good starting material for building field effect transistors, sensors, touch screens and solar cells. Besides, the formation of Hf-C bonds may favor growing high-quality and uniform-coverage dielectric. HfO<inf>2</inf> could be a suitable high-K gate dielectric with a scaling capability down to sub-5-nm for graphene-based transistors.

Original languageEnglish
Article number13523
JournalScientific Reports
Volume5
DOIs
Publication statusPublished - 27 Aug 2015

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atomic layer epitaxy
graphene
damage
evaluation
Raman spectroscopy
oxygen plasma
transistors
field effect transistors
solar cells
photoelectron spectroscopy
scaling

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Tang, Xiaohui ; Reckinger, Nicolas ; Poncelet, Olivier ; Louette, Pierre ; Ureña, Ferran ; Idrissi, Hosni ; Turner, Stuart ; Cabosart, Damien ; Colomer, Jean François ; Raskin, Jean Pierre ; Hackens, Benoit ; Francis, Laurent A. / Damage evaluation in graphene underlying atomic layer deposition dielectrics. In: Scientific Reports. 2015 ; Vol. 5.
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abstract = "Based on micro-Raman spectroscopy (μRS) and X-ray photoelectron spectroscopy (XPS), we study the structural damage incurred in monolayer (1L) and few-layer (FL) graphene subjected to atomic-layer deposition of HfO2 and Al2 O3 upon different oxygen plasma power levels. We evaluate the damage level and the influence of the HfO2 thickness on graphene. The results indicate that in the case of Al2 O3/graphene, whether 1L or FL graphene is strongly damaged under our process conditions. For the case of HfO 2 /graphene, μRS analysis clearly shows that FL graphene is less disordered than 1L graphene. In addition, the damage levels in FL graphene decrease with the number of layers. Moreover, the FL graphene damage is inversely proportional to the thickness of HfO2 film. Particularly, the bottom layer of twisted bilayer (t-2L) has the salient features of 1L graphene. Therefore, FL graphene allows for controlling/limiting the degree of defect during the PE-ALD HfO2 of dielectrics and could be a good starting material for building field effect transistors, sensors, touch screens and solar cells. Besides, the formation of Hf-C bonds may favor growing high-quality and uniform-coverage dielectric. HfO2 could be a suitable high-K gate dielectric with a scaling capability down to sub-5-nm for graphene-based transistors.",
author = "Xiaohui Tang and Nicolas Reckinger and Olivier Poncelet and Pierre Louette and Ferran Ure{\~n}a and Hosni Idrissi and Stuart Turner and Damien Cabosart and Colomer, {Jean Fran{\cc}ois} and Raskin, {Jean Pierre} and Benoit Hackens and Francis, {Laurent A.}",
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Tang, X, Reckinger, N, Poncelet, O, Louette, P, Ureña, F, Idrissi, H, Turner, S, Cabosart, D, Colomer, JF, Raskin, JP, Hackens, B & Francis, LA 2015, 'Damage evaluation in graphene underlying atomic layer deposition dielectrics', Scientific Reports, vol. 5, 13523. https://doi.org/10.1038/srep13523

Damage evaluation in graphene underlying atomic layer deposition dielectrics. / Tang, Xiaohui; Reckinger, Nicolas; Poncelet, Olivier; Louette, Pierre; Ureña, Ferran; Idrissi, Hosni; Turner, Stuart; Cabosart, Damien; Colomer, Jean François; Raskin, Jean Pierre; Hackens, Benoit; Francis, Laurent A.

In: Scientific Reports, Vol. 5, 13523, 27.08.2015.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Damage evaluation in graphene underlying atomic layer deposition dielectrics

AU - Tang, Xiaohui

AU - Reckinger, Nicolas

AU - Poncelet, Olivier

AU - Louette, Pierre

AU - Ureña, Ferran

AU - Idrissi, Hosni

AU - Turner, Stuart

AU - Cabosart, Damien

AU - Colomer, Jean François

AU - Raskin, Jean Pierre

AU - Hackens, Benoit

AU - Francis, Laurent A.

PY - 2015/8/27

Y1 - 2015/8/27

N2 - Based on micro-Raman spectroscopy (μRS) and X-ray photoelectron spectroscopy (XPS), we study the structural damage incurred in monolayer (1L) and few-layer (FL) graphene subjected to atomic-layer deposition of HfO2 and Al2 O3 upon different oxygen plasma power levels. We evaluate the damage level and the influence of the HfO2 thickness on graphene. The results indicate that in the case of Al2 O3/graphene, whether 1L or FL graphene is strongly damaged under our process conditions. For the case of HfO 2 /graphene, μRS analysis clearly shows that FL graphene is less disordered than 1L graphene. In addition, the damage levels in FL graphene decrease with the number of layers. Moreover, the FL graphene damage is inversely proportional to the thickness of HfO2 film. Particularly, the bottom layer of twisted bilayer (t-2L) has the salient features of 1L graphene. Therefore, FL graphene allows for controlling/limiting the degree of defect during the PE-ALD HfO2 of dielectrics and could be a good starting material for building field effect transistors, sensors, touch screens and solar cells. Besides, the formation of Hf-C bonds may favor growing high-quality and uniform-coverage dielectric. HfO2 could be a suitable high-K gate dielectric with a scaling capability down to sub-5-nm for graphene-based transistors.

AB - Based on micro-Raman spectroscopy (μRS) and X-ray photoelectron spectroscopy (XPS), we study the structural damage incurred in monolayer (1L) and few-layer (FL) graphene subjected to atomic-layer deposition of HfO2 and Al2 O3 upon different oxygen plasma power levels. We evaluate the damage level and the influence of the HfO2 thickness on graphene. The results indicate that in the case of Al2 O3/graphene, whether 1L or FL graphene is strongly damaged under our process conditions. For the case of HfO 2 /graphene, μRS analysis clearly shows that FL graphene is less disordered than 1L graphene. In addition, the damage levels in FL graphene decrease with the number of layers. Moreover, the FL graphene damage is inversely proportional to the thickness of HfO2 film. Particularly, the bottom layer of twisted bilayer (t-2L) has the salient features of 1L graphene. Therefore, FL graphene allows for controlling/limiting the degree of defect during the PE-ALD HfO2 of dielectrics and could be a good starting material for building field effect transistors, sensors, touch screens and solar cells. Besides, the formation of Hf-C bonds may favor growing high-quality and uniform-coverage dielectric. HfO2 could be a suitable high-K gate dielectric with a scaling capability down to sub-5-nm for graphene-based transistors.

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JO - Scientific Reports

JF - Scientific Reports

SN - 2045-2322

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