A procedure for gold soldering using a Si-Au alloy produced by Si implantation in Au

V. John Kennedy, Guy Terwagne, Guy Demortier

    Research output: Contribution to journalArticlepeer-review

    Original languageEnglish
    Pages (from-to)1339-1347
    Number of pages9
    JournalModern Physics Letters B
    Volume15
    Issue number28-29
    Publication statusPublished - 2001

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