2nd international symposium on polymer surface modification: relevance to adhesion

Activity: Participating in or organising an event typesParticipation in conference


Communication invitee: "Copper metallization of polymers for microelectronic applications". Co-auteurs: J.-J. Lemaire, A. Rajagopal, C. Gregoire, M. Baklanov, S. Vanhaemelmeersch, K. Maex & J.-J. Waeterloos
Period24 May 199926 May 1999
Event typeConference
LocationNewark, Etats-UnisShow on map