Abstract
A process is claimed for the formation of a coating on a substrate (17) by cathodic sputtering in an enclosure (15,16) in the presence of an ionised gas, using a target (1) presenting a surface layer oriented towards the substrate (17) and containing at least one of a number of elements to be deposited on the substrate (17) by cathodic sputtering. This sputtering is produced under conditions such that the element or elements can be ejected from the surface layer under the effect of the ionised gas in order to then be deposited on the substrate. The surface layer of the target is fed with the elements to be deposited on the substrate and the surface layer is maintained or brought into the liquid state in a manner that allows a distribution, preferably uniformly, of the elements fed to the surface of the target. The device used to put this process into service is also claimed.
| Translated title of the contribution | Procédé et dispositif pour la formation d'un revêtement sur un substrat par pulvérisation cathodique. |
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| Original language | English |
| Patent number | EP0685571 |
| IPC | C23C 14/ 56 A I |
| Priority date | 2/06/94 |
| Publication status | Published - 6 Dec 1995 |