27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message

Paolo Arcaini; Maurice H. Ter Beek; Gilles Perrouin; Iris Reinhartz-Berger; Miguel R. Luaces; Christa Schwanninger; Shaukat Ali; Mahsa Varshosaz; Angelo Gargantini; Stefania Gnesi; Malte Lochau; Laura Semini; Ivan MacHado; Silvia Regina Vergilio; Rick Rabiser; Tao Yue; Xavier Devroey; Mónica Pinto; Hironori Washizaki; Lea Gerling; Jacob Krüger; Goetz Botterweck; Natsuko Noda; Fuyuki Ishikawa; Mitsuhiro Kitani; Tsutomu Kobayashi; Yuta Yanagi; Xiao Yi Zhang; Zhenya Zhang; Nobukazu Yoshioka; Stefan Klikovits

27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message

Paolo Arcaini, Maurice H. Ter Beek, Gilles Perrouin, Iris Reinhartz-Berger, Miguel R. Luaces, Christa Schwanninger, Shaukat Ali, Mahsa Varshosaz, Angelo Gargantini, Stefania Gnesi, Malte Lochau, Laura Semini, Ivan MacHado, Silvia Regina Vergilio, Rick Rabiser, Tao Yue, Xavier Devroey, Mónica Pinto, Hironori Washizaki, Lea GerlingJacob Krüger, Goetz Botterweck, Natsuko Noda, Fuyuki Ishikawa, Mitsuhiro Kitani, Tsutomu Kobayashi, Yuta Yanagi, Xiao Yi Zhang, Zhenya Zhang, Nobukazu Yoshioka, Stefan Klikovits

Research output: Contribution in Book/Catalog/Report/Conference proceeding › Foreword/postscript

Original language	English
Title of host publication	Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023
Publisher	ACM Press
Pages	X
Volume	A-1
Publication status	Published - 28 Aug 2023
Event	27th ACM International Systems and Software Product Line Conference, SPLC 2023 - Tokyo, Japan Duration: 28 Aug 2023 → 1 Sept 2023

Publication series

Name	ACM International Conference Proceeding Series
Publisher	ACM Press

Conference

Conference	27th ACM International Systems and Software Product Line Conference, SPLC 2023
Country/Territory	Japan
City	Tokyo
Period	28/08/23 → 1/09/23

Cite this

Arcaini, P., Ter Beek, M. H., Perrouin, G., Reinhartz-Berger, I., Luaces, M. R., Schwanninger, C., Ali, S., Varshosaz, M., Gargantini, A., Gnesi, S., Lochau, M., Semini, L., MacHado, I., Vergilio, S. R., Rabiser, R., Yue, T., Devroey, X., Pinto, M., Washizaki, H., ... Klikovits, S. (2023). 27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message. In Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023 (Vol. A-1, pp. X). (ACM International Conference Proceeding Series). ACM Press.

@inbook{ab93e9babd1840acba406cdb96d19345,

title = "27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message",

author = "Paolo Arcaini and {Ter Beek}, {Maurice H.} and Gilles Perrouin and Iris Reinhartz-Berger and Luaces, {Miguel R.} and Christa Schwanninger and Shaukat Ali and Mahsa Varshosaz and Angelo Gargantini and Stefania Gnesi and Malte Lochau and Laura Semini and Ivan MacHado and Vergilio, {Silvia Regina} and Rick Rabiser and Tao Yue and Xavier Devroey and M{\'o}nica Pinto and Hironori Washizaki and Lea Gerling and Jacob Kr{\"u}ger and Goetz Botterweck and Natsuko Noda and Fuyuki Ishikawa and Mitsuhiro Kitani and Tsutomu Kobayashi and Yuta Yanagi and Zhang, {Xiao Yi} and Zhenya Zhang and Nobukazu Yoshioka and Stefan Klikovits",

year = "2023",

month = aug,

day = "28",

language = "English",

volume = "A-1",

series = "ACM International Conference Proceeding Series",

publisher = "ACM Press",

pages = "X",

booktitle = "Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023",

address = "United States",

note = "27th ACM International Systems and Software Product Line Conference, SPLC 2023 ; Conference date: 28-08-2023 Through 01-09-2023",

}

Arcaini, P, Ter Beek, MH, Perrouin, G, Reinhartz-Berger, I, Luaces, MR, Schwanninger, C, Ali, S, Varshosaz, M, Gargantini, A, Gnesi, S, Lochau, M, Semini, L, MacHado, I, Vergilio, SR, Rabiser, R, Yue, T, Devroey, X, Pinto, M, Washizaki, H, Gerling, L, Krüger, J, Botterweck, G, Noda, N, Ishikawa, F, Kitani, M, Kobayashi, T, Yanagi, Y, Zhang, XY, Zhang, Z, Yoshioka, N & Klikovits, S 2023, 27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message. in Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023. vol. A-1, ACM International Conference Proceeding Series, ACM Press, pp. X, 27th ACM International Systems and Software Product Line Conference, SPLC 2023, Tokyo, Japan, 28/08/23.

27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message. / Arcaini, Paolo; Ter Beek, Maurice H.; Perrouin, Gilles et al.
Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023. Vol. A-1 ACM Press, 2023. p. X (ACM International Conference Proceeding Series).

Research output: Contribution in Book/Catalog/Report/Conference proceeding › Foreword/postscript

TY - CHAP

T1 - 27th ACM International Systems and Software Product Line Conference, SPLC 2023

T2 - 27th ACM International Systems and Software Product Line Conference, SPLC 2023

AU - Arcaini, Paolo

AU - Ter Beek, Maurice H.

AU - Perrouin, Gilles

AU - Reinhartz-Berger, Iris

AU - Luaces, Miguel R.

AU - Schwanninger, Christa

AU - Ali, Shaukat

AU - Varshosaz, Mahsa

AU - Gargantini, Angelo

AU - Gnesi, Stefania

AU - Lochau, Malte

AU - Semini, Laura

AU - MacHado, Ivan

AU - Vergilio, Silvia Regina

AU - Rabiser, Rick

AU - Yue, Tao

AU - Devroey, Xavier

AU - Pinto, Mónica

AU - Washizaki, Hironori

AU - Gerling, Lea

AU - Krüger, Jacob

AU - Botterweck, Goetz

AU - Noda, Natsuko

AU - Ishikawa, Fuyuki

AU - Kitani, Mitsuhiro

AU - Kobayashi, Tsutomu

AU - Yanagi, Yuta

AU - Zhang, Xiao Yi

AU - Zhang, Zhenya

AU - Yoshioka, Nobukazu

AU - Klikovits, Stefan

PY - 2023/8/28

Y1 - 2023/8/28

UR - http://www.scopus.com/inward/record.url?scp=85175964101&partnerID=8YFLogxK

M3 - Foreword/postscript

AN - SCOPUS:85175964101

VL - A-1

T3 - ACM International Conference Proceeding Series

SP - X

BT - Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023

PB - ACM Press

Y2 - 28 August 2023 through 1 September 2023

ER -

Arcaini P, Ter Beek MH, Perrouin G, Reinhartz-Berger I, Luaces MR, Schwanninger C et al. 27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message. In Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023. Vol. A-1. ACM Press. 2023. p. X. (ACM International Conference Proceeding Series).

27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message

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