Stack of Graphene/Copper Foils/Graphene by Low-Pressure Chemical Vapor Deposition as a Thermal Interface Material

Although there are several kinds of thermal interfacial materials used in the electronic semiconductor industry, such as thermal grease, thermal glue, thermal gap filler, thermal pad and thermal adhesive, the problem of heat dissipation still remains a challenge. In this context, chemical vapor deposition of graphene on copper foils in vacuum has recently become considered as a wonderful hybrid material (graphene/copper/graphene) for more demanding thermal management applications, thanks to the unique properties of graphene in comparison with other materials. We found that the thermal properties of copper films change as graphene is deposited on top of the copper surface. Especially, a single atomic plane of graphene can significantly increase the film’s thermal conductivity. Our graphene on copper foil was analyzed and measured by optical microscopy, Raman spectroscopy, scanning electron microscopy and heat transfer technique. This stack of graphene/copper/graphene materials may play a very important role as a potential material with superior thermal conductivity to replace traditional copper shim thermal pads in current electronic devices.