Abstract
Process for forming a coating (5) on a substrate (3) by reactive cathode sputtering in a closed vessel (1) in the presence of a plasma of an unreactive gas and of a reactive gas containing the element(s) from which the abovementioned coating is to be formed, according to which use is made of a target (2) which has a surface layer (4) directed towards the substrate and containing at least one of the elements to be deposited on the latter by cathode sputtering, according to which the thickness of this surface layer (4) is controlled during the cathode sputtering by adjusting the concentration of the gases in the abovementioned closed vessel (1).
| Translated title of the contribution | Procédé pour la formation d'un revêtement sur un substrat par pulvérisation cathodique réactive. |
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| Original language | English |
| Patent number | EP0620290 |
| IPC | H01L 21/ 203 A I |
| Priority date | 16/04/93 |
| Publication status | Published - 19 Oct 1994 |