Abstract
In forming a coating of an element, especially a metal, on a substrate moving through an evaporation chamber, the novelty is that (a) the chamber is equipped with a target which has a substrate-facing surface layer containing the element; (b) the coating is formed by vapour deposition and simultaneous cathodic sputtering of the element from the target; and (c) the ratio of the amounts of evaporated and sputtered element is regulated by the energy supply to the target. Also claimed is a coating apparatus especially for carrying out the above process, the apparatus having (i) a chamber (3) equipped with a target (4) having a surface layer (5) facing the substrate (1) and containing one or more of the elements of the coating (2); (ii) a transport system for moving the substrate (1) preferably continuously past the target (4); (iii) a heat regulating system (9) for holding the surface layer (5) optionally in the liquid state and for controlled evaporation of the element; and (iv) a system (6, 8, 10, 11) for cathodic sputtering of the element from the target (4) towards the substrate (1).
| Translated title of the contribution | Procédé et dispositif pour la formation d'un revêtement sur un substrat |
|---|---|
| Original language | English |
| Patent number | EP0780486 |
| IPC | C23C 14/ 56 A I |
| Priority date | 20/12/95 |
| Publication status | Published - 25 Jun 1997 |