Polyamide compsns. with improved rheology for extruded prods.

Be Vankan, Robert, Liers (Inventor), Be Degee, Philippe, , Grace-Hollogne (Inventor), Be Jerome, Robert, Esneux (Inventor), Be Teyssie, Philippe, , Neuville-En-Condroz (Inventor)

Research output: Patent

Abstract

Compsns. (I) based on polyamides obtd. by condensation of xylylene-diamine(s) (XD) with dicarboxylic acid(s) also contain copolymer(s) (II) of methyl methacrylate (MMA) and (meth)acrylic acid (M/AA) contg. not more than 30 wt.% M/AA. Also claimed is a process for the prodn. of objects by the thermo mechanical processing of (I).

Original languageEnglish
Patent numberDE19530101
IPCC08L 33/ 02 A N
Priority date16/08/94
Publication statusPublished - 22 Feb 1996
Externally publishedYes

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