A metal substrate cleaning process comprises: creating a plasma in a mixture of hydrogen, hydrogen compounds and/or inert gas (e.g. argon) to generate radicals and/or ions for acting on the substrate which is negatively biased with respect to an anode facing the surface to be cleaned. Also claimed is a metal substrate cleaning apparatus, especially for carrying out the above process, comprising devices for generating a plasma and negatively biasing the substrate surface.
|Translated title of the contribution||Procédé et dispositif pour le décapage d'un substrat métallique|
|IPC||C23G 5/ 00 A I|
|Publication status||Published - 25 Jun 1997|