Abstract
A metal substrate cleaning process comprises: creating a plasma in a mixture of hydrogen, hydrogen compounds and/or inert gas (e.g. argon) to generate radicals and/or ions for acting on the substrate which is negatively biased with respect to an anode facing the surface to be cleaned. Also claimed is a metal substrate cleaning apparatus, especially for carrying out the above process, comprising devices for generating a plasma and negatively biasing the substrate surface.
Translated title of the contribution | Procédé et dispositif pour le décapage d'un substrat métallique |
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Original language | English |
Patent number | EP0780485 |
IPC | C23G 5/ 00 A I |
Priority date | 20/12/95 |
Publication status | Published - 25 Jun 1997 |