Mechanistic studies of silicon wafer bonding and layer exfoliation

Markus Weldon; Vittorio Marsico; Yves Chabal; A Agarwal; D Eaglesham; J Sapjeta; W Brown; D Jacobson; Yves Caudano; Stan Christman; Ed Chaban

Mechanistic studies of silicon wafer bonding and layer exfoliation

Markus Weldon, Vittorio Marsico, Yves Chabal, A Agarwal, D Eaglesham, J Sapjeta, W Brown, D Jacobson, Yves Caudano, Stan Christman, Ed Chaban

Namur Research Institute for Life Sciences

Research output: Contribution in Book/Catalog/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings of the fourth international symposium on Semiconductor Wafer Bonding
Subtitle of host publication	Science, Technology, and Applications
Editors	Ulrich Gösele, Helmut Baumgart, Takano Abe, Charles Hunt, S. Iyer
Place of Publication	Pennington
Publisher	Electrochemical Society, Inc.
Pages	229-248
Number of pages	20
ISBN (Print)	1-56677-189-7
Publication status	Published - 1998

Publication series

Name	Proceedings
Publisher	Electrochemical Society
Number	36
Volume	97

Cite this

Weldon, M., Marsico, V., Chabal, Y., Agarwal, A., Eaglesham, D., Sapjeta, J., Brown, W., Jacobson, D., Caudano, Y., Christman, S., & Chaban, E. (1998). Mechanistic studies of silicon wafer bonding and layer exfoliation. In U. Gösele, H. Baumgart, T. Abe, C. Hunt, & S. Iyer (Eds.), Proceedings of the fourth international symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (pp. 229-248). (Proceedings; Vol. 97, No. 36). Electrochemical Society, Inc..

Weldon, Markus ; Marsico, Vittorio ; Chabal, Yves et al. / Mechanistic studies of silicon wafer bonding and layer exfoliation. Proceedings of the fourth international symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. editor / Ulrich Gösele ; Helmut Baumgart ; Takano Abe ; Charles Hunt ; S. Iyer. Pennington : Electrochemical Society, Inc., 1998. pp. 229-248 (Proceedings; 36).

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title = "Mechanistic studies of silicon wafer bonding and layer exfoliation",

author = "Markus Weldon and Vittorio Marsico and Yves Chabal and A Agarwal and D Eaglesham and J Sapjeta and W Brown and D Jacobson and Yves Caudano and Stan Christman and Ed Chaban",

year = "1998",

language = "English",

isbn = "1-56677-189-7",

series = "Proceedings",

publisher = "Electrochemical Society, Inc.",

number = "36",

pages = "229--248",

editor = "Ulrich G{\"o}sele and Helmut Baumgart and Takano Abe and Charles Hunt and S. Iyer",

booktitle = "Proceedings of the fourth international symposium on Semiconductor Wafer Bonding",

address = "United States",

}

Weldon, M, Marsico, V, Chabal, Y, Agarwal, A, Eaglesham, D, Sapjeta, J, Brown, W, Jacobson, D, Caudano, Y, Christman, S & Chaban, E 1998, Mechanistic studies of silicon wafer bonding and layer exfoliation. in U Gösele, H Baumgart, T Abe, C Hunt & S Iyer (eds), Proceedings of the fourth international symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. Proceedings, no. 36, vol. 97, Electrochemical Society, Inc., Pennington, pp. 229-248.

Mechanistic studies of silicon wafer bonding and layer exfoliation. / Weldon, Markus; Marsico, Vittorio; Chabal, Yves et al.
Proceedings of the fourth international symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. ed. / Ulrich Gösele; Helmut Baumgart; Takano Abe; Charles Hunt; S. Iyer. Pennington: Electrochemical Society, Inc., 1998. p. 229-248 (Proceedings; Vol. 97, No. 36).

Research output: Contribution in Book/Catalog/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Mechanistic studies of silicon wafer bonding and layer exfoliation

AU - Weldon, Markus

AU - Marsico, Vittorio

AU - Chabal, Yves

AU - Agarwal, A

AU - Eaglesham, D

AU - Sapjeta, J

AU - Brown, W

AU - Jacobson, D

AU - Caudano, Yves

AU - Christman, Stan

AU - Chaban, Ed

PY - 1998

Y1 - 1998

M3 - Conference contribution

SN - 1-56677-189-7

T3 - Proceedings

SP - 229

EP - 248

BT - Proceedings of the fourth international symposium on Semiconductor Wafer Bonding

A2 - Gösele, Ulrich

A2 - Baumgart, Helmut

A2 - Abe, Takano

A2 - Hunt, Charles

A2 - Iyer, S.

PB - Electrochemical Society, Inc.

CY - Pennington

ER -

Weldon M, Marsico V, Chabal Y, Agarwal A, Eaglesham D, Sapjeta J et al. Mechanistic studies of silicon wafer bonding and layer exfoliation. In Gösele U, Baumgart H, Abe T, Hunt C, Iyer S, editors, Proceedings of the fourth international symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. Pennington: Electrochemical Society, Inc. 1998. p. 229-248. (Proceedings; 36).