Study by local electrochemical methods (SKP and SVET) of the behaviour of copper, nickel and copper/nickel substrates modified by self-assembled monolayers

Project: PHD

Project Details


The purpose of this research work is to investigate by local electrochemical methods (micrometer scale) the behaviour of Cu, Ni and CU/Ni substrates modified by three molecular connectors : n-dodecanethiol, le n-dodecyltrichlorosilane et le n-dodecyltrimethoxysilane. The goals are the qualification by such techniques (SKP and SVET), in conjunction with spectroscopic techniques such as XPS and ToF-SIMS, the quality of such monolayers and their resistance to aggressive conditions (ambient atmosphere, acid, base and halogenide containing solutions).
Effective start/end date1/04/021/12/08


  • deterioration of resistance
  • Scanning Kelvin Probe (or SKP)
  • Scanning Vibrating Electrode Technique (or SVET)
  • Local electrochemistry
  • self-assembled monolayers


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