Filter
Foreword/postscript

Search results

  • 2023

    27th ACM International Systems and Software Product Line Conference, SPLC 2023: Welcome Message

    Arcaini, P., Ter Beek, M. H., Perrouin, G., Reinhartz-Berger, I., Luaces, M. R., Schwanninger, C., Ali, S., Varshosaz, M., Gargantini, A., Gnesi, S., Lochau, M., Semini, L., MacHado, I., Vergilio, S. R., Rabiser, R., Yue, T., Devroey, X., Pinto, M., Washizaki, H., Gerling, L., & 11 othersKrüger, J., Botterweck, G., Noda, N., Ishikawa, F., Kitani, M., Kobayashi, T., Yanagi, Y., Zhang, X. Y., Zhang, Z., Yoshioka, N. & Klikovits, S., 28 Aug 2023, Proceedings of the 27th ACM International Systems and Software Product Line Conference, SPLC 2023. ACM Press, Vol. A-1. p. X (ACM International Conference Proceeding Series).

    Research output: Contribution in Book/Catalog/Report/Conference proceedingForeword/postscript

  • 2019

    Welcome from the chairs

    Fontana, F. A., Perrouin, G., Ampatzoglou, A., Acher, M., Walter, B., Cordy, M., Palomba, F. & Devroey, X., 27 Aug 2019, MaLTeSQuE 2019: Proceedings of the 3rd ACM SIGSOFT International Workshop on Machine Learning Techniques for Software Quality Evaluation. Arcelli Fontana, F., Walter, B., Ampatzoglou, A., Palomba, F., Perrouin, G., Acher, M., Cordy, M. & Devroey, X. (eds.). ACM Press, p. III-IV

    Research output: Contribution in Book/Catalog/Report/Conference proceedingForeword/postscript

    File
    20 Downloads (Pure)
Your message has successfully been sent.
Your message was not sent due to an error.