Adhesion 2005, the 9th International Conference on the Scienxe and Technology of Adhesion and Adhesives

Pireaux, J. (Participant)

Activity: Participating in or organising an event typesParticipation in conference

Description

<Silane molecular glue layers for a new low temperature bonding technology > ; A. Azioune, F. De Buyl and J.J. Pireaux
Period7 Sep 20059 Sep 2005
Event typeConference
LocationOxford, UK